INFRASTRUCTURE◐ DEVELOPINGM · Material▲ Rising
CPO roadmaps sharpen the next scale-up bottleneck
Aug 3, 2026SOURCE: tomshardware.com
SO WHAT
Whoever controls this link layer shapes the thousand-day window: the bottleneck is shifting from software ambition to physical access and manufacturing depth.
TSMC, Intel, Samsung, and GlobalFoundries are mapping co-packaged optics for next-generation connectivity. The wire is moving closer to the chip, a small but telling phase transition in compute infrastructure.
This is Negative Resistance’s reframed reading of a reported signal. The headline and analysis above are our interpretation through the thousand-day-window lens. The original reporting lives at the source linked above.